This fixes the tradefed build error caused by aosp/2582191.
Bug: 280440941
Test: `BUILD_BROKEN_DISABLE_BAZEL=true m dist` on tradefed branch.
(cherry picked from https://android-review.googlesource.com/q/commit:c74a4011e2815f2ffc3815176c958a0fdabbd621)
Merged-In: I34c9fea0a5f7110c9b2bda1986df82afa3eafc79
Change-Id: I34c9fea0a5f7110c9b2bda1986df82afa3eafc79
Environment variables HWASAN_INCLUDE_PATHS and
PRODUCT_HWASAN_INCLUDE_PATHS can be used to enable HWASan for multiple
modules, by just adding the module directory to the env variable.
Bug: b/271948407
Test: Set specific module directory to above env variable and check the
assembly codes of output elf files after building, finding hwasan
related symbols inside.
Merged-In: I4493cb627fb564ee317eb95bd24ec020d42ae28c
Change-Id: I4493cb627fb564ee317eb95bd24ec020d42ae28c
(cherry picked from commit e235ded733)
This reverts commit a527b1a0ee.
Reason for revert: tradefed-contrib isn't an allowed dependency outside tradefed. Suites shouldn't use it. This breaks prebuilts in udc-*
Bug: 280372052
Change-Id: Id840568f36a801e19e7bb8e9c34cef2aeb625f1d
Ignore-AOSP-First: revert of CL submitted in internal anyway
The device's max supported page size is determined by the
build variable TARGET_MAX_PAGE_SIZE_SUPPORTED.
Export this variable as system property for use in tests.
Bug: 277360995
Test: atest -c vendor_elf_alignment_test -s <serial>
Signed-off-by: Kalesh Singh <kaleshsingh@google.com>
(cherry picked from https://android-review.googlesource.com/q/commit:72222fbec9b2efd6709e263dc16bcca98f216c15)
Merged-In: I4f33a42de359c8119e55056f9fd9c7147c7058ec
Change-Id: I4f33a42de359c8119e55056f9fd9c7147c7058ec
The PRODUCT_MAX_PAGE_SIZE_SUPPORTED will be used to define the
ELF segment alignment of the binaries (executables and shared
libraries). The alignment is set based on these conditions:
- If PRODUCT_MAX_PAGE_SIZE_SUPPORTED is defined, that value will be
used to align the binaries. If not defined, see condition below:
- If it is a low memory device, 4096 will be the alignment. If it is
not low memory device, see conditon below:
- If VSR vendor API level < 34, 4096 will be the alignment, otherwise
it will be 65536.
Test: Built for in Pixel 4a, 6 and verified the alignment with readelf.
Bug: 276963698
Bug: 276801883
(cherry picked from https://android-review.googlesource.com/q/commit:e5c0c174d50e4fab5db797dc815a875d673eadac)
Merged-In: I53a8902ab62e6d378aec84c28bc627f0e8a98500
Change-Id: I53a8902ab62e6d378aec84c28bc627f0e8a98500
Previously we used USE_ANGLE to determine whether the build should include
ANGLE drivers, this patch consolidates that into a separate Makefile.
Bug: b/270994705
Test: atest CtsAngleIntegrationHostTestCases
Change-Id: I4d7ffb869ced219009446d907230178e4b940157
Merged-In: I4d7ffb869ced219009446d907230178e4b940157
This is a change cherry-picked from aosp:
https://r.android.com/2560175
Merged-In: I0fb881962ab77abd18f05d33393c4ee11694109c
Bug: b/270994705
Test: m -j45; flash and check Pixel 7 boots fine
atest CtsAngleIntegrationHostTestCases
Change-Id: I4632ff64bc26623c796b992a71761a754149955a
This allows create_brick_ota binary to be used by downloading
otatools.zip from ab, instead of having to build it locally.
Bug: 278925744
Change-Id: I704355b74bc2de7e8d5b881deb01efbee0fdda2a
Currently, PRODUCT_AFDO_PROFILES is generally applied to all products and is not semantically treated as a product config varilable.
Splitting this allows us:
1. Explicitly tell that PRODUCT_AFDO_PROFILES takes precedence over product-agnostic profiles in AFDO_PROFILES
2. Add PRODUCT_AFDO_PROFILES to _product_vars_list
Ignore-AOSP-First: ag/22604900 in the same topic is in internal repo
Test: Define PRODUCT_AFDO_PROFILES in a product config and make sure it appears first in the soong var AfdoProfiles
Bug: 277215393
Change-Id: I284f6308d456994bb72129cb0d7be7cd091993ae
build/make/core/Makefile modifies ALL_DEFAULT_INSTALLED_MODULES,
move the cleanup logic below where it is included so that any
additions are covered by the cleanup logic.
Bug: 267014648
Test: manual
Change-Id: If3ab59aa19273fb20f171a3bb74ea1a2c3841585
This is to reduce build rule divergence among targets. We only need the
path under PRODUCT_OUT.
Bug: 277662244
Test: build and boot
Change-Id: Ica8776d1779c47305c3c74015be2b3597cbdf95c
This is needed so we can run hwasan-enabled apps for debugging on normal
system images.
Bug: 276930343
Change-Id: Ie572d77307e5e6268b851ea5c96aae05d588dae3
There will be more SBOM files for unbundled APEXs/APks, so collect all in sbom/ for scilo ingestion later.
Bug: 266726655
Test: CIs
Test: lunch aosp_cf_x86_64_phone-userdebug && m dist
Change-Id: Iff4f1177df425095cef3c95c7bf4b85c62fa2e8d
This reverts commit fd358ae340.
Reason for revert: fixed the issues in aosp/2529028 and aosp/2524438.
Change-Id: Ieb4e6189a9357dafe81f15c72d5603166d9caa4d
